Energy based failure criterion for interfacial delamination

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 201-205

  Chung, Paular W K ^a   Chan, S K ^a   Yuen, Matthew M F ^a   Lam, David C C ^a   Teng, Annette ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHIP SCALE PACKAGES; COPPER; DELAMINATION; ELASTIC MODULI; ELECTROMAGNETIC COMPATIBILITY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HYDRAULICS; MODIFIED ATMOSPHERE PACKAGING; PACKAGING; PACKAGING MATERIALS; STRAIN ENERGY; TESTING;

ADHESION PROPERTIES; EPOXY MOLDING COMPOUNDS; HYDROSTATIC STRAIN; INTEGRATED CIRCUIT PACKAGE; INTERFACIAL ADHESIONS; INTERFACIAL DELAMINATION; LINEAR RELATIONSHIPS; PACKAGE RELIABILITY;

INTERFACES (MATERIALS);

EID: 0037738271     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904155     Document Type: Conference Paper

References (9)

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