Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling

Experimental Mechanics

Volumn 44, Issue 2, 2004, Pages 214-220

  Chien, Chi Hui ^a   Chen, Yung Chang ^a,b   Hsieh, Chi Chang ^a   Chiou, Yii Tay ^c   Wu, Yii Der ^a   Chen, Thaiping P ^a,d  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^d FORTUNE INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Adhesion; Button shear test; Solder mask; Thermal cycle; Underfill

Indexed keywords

ADHESION; DEGRADATION; FLIP CHIP DEVICES; FRACTURE; INTERFACES (MATERIALS); MASKS; MICROELECTRONICS; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

ADHESION STRENGTH; FRACTURE SURFACES; INTERFACIAL STRENGTH; SOLDER MASKS;

SOLDERING ALLOYS;

THERMODYNAMICS;

EID: 1942530830     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1177/0014485104039765     Document Type: Article

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