Effect of black copper oxide on interface adhesion between copper substrate and glob-top resin

4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 61-69

  Lebbai, M ^a   Kim, J K ^a   Yuen, M M F ^a   Tong, P ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Adhesives; Bonding; Coatings; Copper; Resins; Rough surfaces; Surface cracks; Surface finishing; Surface morphology; Surface roughness

Indexed keywords

ADHESION; ADHESIVES; BOND STRENGTH (CHEMICAL); BOND STRENGTH (MATERIALS); BONDING; CHEMICAL ANALYSIS; CHEMICAL BONDS; CHEMICAL ELEMENTS; COATINGS; COPPER; COPPER METALLURGY; COPPER OXIDES; ELECTRONICS PACKAGING; FINISHING; FREE ENERGY; INTERFACES (MATERIALS); JOINING; MANUFACTURE; NICKEL COATINGS; PROTECTIVE COATINGS; RESINS; SOLDERED JOINTS; SUBSTRATES; SURFACE DEFECTS; SURFACE MORPHOLOGY;

BLACK OXIDE COATING; INTERFACE BOND STRENGTH; INTERFACIAL BONDING STRENGTH; MECHANICAL INTERLOCKING; ROUGH SURFACES; ROUGHNESS OF SURFACE; SURFACE CRACKS; SURFACE FINISHING;

SURFACE ROUGHNESS;

EID: 77956535141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.2000.860575     Document Type: Conference Paper

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