An energy-based method to predict delamination in electronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 834-838

  Fan, H B ^a   Chung, Paular W K ^a   Yuen, Matthew M F ^a   Chan, Philip C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; ELASTICITY; FAILURE ANALYSIS; FRACTURE; INTERFACES (MATERIALS); TENSILE TESTING;

STRAIN ENERGY;

ELECTRONICS PACKAGING;

EID: 0036287229     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. Fracture mechanics applied to engineering problems-strain energy density criterion
2. Ball grid array (BGA) packages with the copper core solder balls
3. Failure of quasi-isotropic composite laminates with free edges
4. Experimental and analytical studies on the onset of delamination in laminated composites
5. Debonding in overmolded integrated circuit packages
6. A failure criterion for debonding between encapsulants and leadframes in plastic IC packages
7. A methodology for predicting failure sites and failure modes in an IC package