A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1165-1169

  Tay, A A O ^a   Phang, J S ^a   Wong, E H ^b   Ranjan, R ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); DELAMINATION; FRACTURE MECHANICS; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MECHANICAL TESTING; MECHANICAL VARIABLES MEASUREMENT; METALS; MOISTURE; ORGANIC POLYMERS; TEMPERATURE MEASUREMENT;

BI-MATERIALS INTERFACE; MODIFIED BUTTON SHEAR METHOD; POLYMER-METAL INTERFACES; SHEAR TESTS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0038012397     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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3. Tay, A.A.O and Lin, T.Y., 1996, "Effects of Moisture and Delamination on cracking of Plastic IC Packages During Solder Reflow", Proc. 46th Electronic Components and Technology Conference, pp 777-782.
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