메뉴 건너뛰기




Volumn , Issue , 2011, Pages 2397-2404

Investigation of Si IGBT operation at 200°C for traction application

Author keywords

high temperature characteristics; safe operating area; traction application; Trench gate field stop silicon IGBT

Indexed keywords

COOLING DESIGNS; DEVICE CHARACTERIZATION; DEVICE FORWARD CONDUCTION CHARACTERISTICS; FAILURE MECHANISM; HIGH DENSITY; HIGH TEMPERATURE; HIGH TEMPERATURE CHARACTERISTICS; HYBRID VEHICLES; RELIABLE OPERATION; SAFE OPERATING AREA; SHORT-CIRCUIT FAULT; SWITCHING PERFORMANCE; SYSTEMATIC STUDY; THERMAL CONDITION; THERMAL STUDY; TRACTION APPLICATION; TRACTION APPLICATIONS;

EID: 81855173625     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECCE.2011.6064087     Document Type: Conference Paper
Times cited : (15)

References (14)
  • 2
    • 76649133450 scopus 로고    scopus 로고
    • SiC Wirebond Multichip Phase-leg Module Packaging Design and Testing for Harsh Environment
    • Jan.
    • P. Ning, R. Lai, F. Wang, K.D.T. Ngo, V.D. Immanuel, and K.J. Karimi, "SiC Wirebond Multichip Phase-leg Module Packaging Design and Testing for Harsh Environment," IEEE Transactions on Power Electronics, vol. 25, no. 1, pp. 16-23, Jan. 2010.
    • (2010) IEEE Transactions on Power Electronics , vol.25 , Issue.1 , pp. 16-23
    • Ning, P.1    Lai, R.2    Wang, F.3    Ngo, K.D.T.4    Immanuel, V.D.5    Karimi, K.J.6
  • 7
    • 72949100054 scopus 로고    scopus 로고
    • Experimental Characterization and Modeling of High-voltage IGBT Modules offstate Thermal Instability
    • A. Castellazzi, J. Saiz, M. Mermet-Guyennet, "Experimental Characterization and Modeling of High-voltage IGBT Modules offstate Thermal Instability," in conf. EPE, 2009, pp. 1-9.
    • Conf. EPE, 2009 , pp. 1-9
    • Castellazzi, A.1    Saiz, J.2    Mermet-Guyennet, M.3
  • 8
    • 8744242098 scopus 로고    scopus 로고
    • Semiconductor Losses in Voltage Source and Current Source IGBT Converters Based on Analytical Derivation
    • M. H. Bierhoff, F. W. Fuchs, "Semiconductor Losses in Voltage Source and Current Source IGBT Converters Based on Analytical Derivation," in Proc. IEEE PESC, 2004, pp. 2836-2842.
    • Proc. IEEE PESC, 2004 , pp. 2836-2842
    • Bierhoff, M.H.1    Fuchs, F.W.2
  • 10
    • 79955766884 scopus 로고    scopus 로고
    • Influence of Short Circuit conditions on IGBT Short Circuit Current in Motor Drives
    • V. Bolloju, J. Yang, "Influence of Short Circuit conditions on IGBT Short Circuit Current in Motor Drives," in Proc. IEEE APEC, 2011, pp. 1675-1679.
    • Proc. IEEE APEC, 2011 , pp. 1675-1679
    • Bolloju, V.1    Yang, J.2
  • 11
    • 33747789373 scopus 로고    scopus 로고
    • Failure Mechanism of Trench IGBT under Short-circuit after Turn-off
    • Sept. - Nov.
    • A. Benmansour, S. Azzopardia, J. C. Martina and E. Woirgarda, "Failure Mechanism of Trench IGBT under Short-circuit after Turn-off,"Microelectronics and Reliability, vol. 46, no. 9-11, pp. 1778-1783, Sept. -Nov. 2006.
    • (2006) Microelectronics and Reliability , vol.46 , Issue.9-11 , pp. 1778-1783
    • Benmansour, A.1    Azzopardia, S.2    Martina, J.C.3    Woirgarda, E.4
  • 12
    • 80052916816 scopus 로고    scopus 로고
    • IGBT RBSOA non-destructive testing methods Analysis and discussion
    • Sept. - Nov.
    • C. Abbate, G. Busatto, F. Iannuzzo, "IGBT RBSOA non-destructive testing methods Analysis and discussion", Microelectronics Reliability, vol. 50, no. 9-11, pp. 1731-1737, Sept. -Nov. 2010.
    • (2010) Microelectronics Reliability , vol.50 , Issue.9-11 , pp. 1731-1737
    • Abbate, C.1    Busatto, G.2    Iannuzzo, F.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.