Failure mechanism of trench IGBT under short-circuit after turn-off

Microelectronics Reliability

Volumn 46, Issue 9-11, 2006, Pages 1778-1783

  Benmansour, A ^a   Azzopardi, S ^a   Martin, J C ^a   Woirgard, E ^a  

^a UNIVERSITÉ BORDEAUX 1   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CURRENTS; FAILURE (MECHANICAL); OPTIMIZATION; SHORT CIRCUIT CURRENTS; THERMAL EFFECTS; THERMAL STRESS; TWO DIMENSIONAL; VOLTAGE CONTROL;

CURRENT LOADS; POWER SEMICONDUCTOR DEVICES; SHORT CIRCUIT CONDITIONS;

SEMICONDUCTOR DEVICES;

EID: 33747789373     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.07.059     Document Type: Article

References (15)

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