Evelopment of novel lead-free solder composites using carbon nanotube reinforcements

International Journal of Nanoscience

Volumn 4, Issue 4, 2005, Pages 423-429

  Nai, S M L ^a   Gupta, M ^a   Wei, J ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Carbon nanotubes; Composites; Lead free solder; Mechanical properties

Indexed keywords

CARBON NANOTUBES; MICROHARDNESS; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; SINTERING; THERMAL EXPANSION;

LEAD-FREE SOLDER COMPOSITES; NANOCOMPOSITE SOLDER;

COMPOSITE MATERIALS;

EID: 28844436108     PISSN: 0219581X     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0219581X0500367X     Document Type: Article

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