Copper layers deposited on aluminum by galvanic displacement

Journal of Physical Chemistry C

Volumn 115, Issue 45, 2011, Pages 22354-22359

  Ai, J H ^a   Liu, S P ^a   Widharta, N A ^a   Adhikari, S ^a   Anderegg, J W ^b   Hebert, K R ^a  

^a Iowa State University   (United States)

^b U S DEPARTMENT OF ENERGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALKALINE DISSOLUTION; ALUMINUM HYDRIDES; AQUEOUS DEPOSITION; CONTINUOUS LAYERS; COPPER IONS; COPPER LAYER; COPPER NANOPARTICLES; COPPER SULFATE BATHS; GALVANIC DISPLACEMENT; METALLIZATION LAYERS; SEMICONDUCTOR INTERCONNECTS; THIN LAYERS;

ALUMINUM; ALUMINUM FOIL; COPPER; DEPOSITION; DISSOLUTION; METAL IONS; NANOPARTICLES; QUARTZ; SCANNING ELECTRON MICROSCOPY; THIN FILMS;

ALUMINUM COATINGS;

EID: 80955151096     PISSN: 19327447     EISSN: 19327455     Source Type: Journal    
DOI: 10.1021/jp2054266     Document Type: Article

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