Immersion/electroless deposition of Ou on Ta

Electrochemical and Solid-State Letters

Volumn 7, Issue 5, 2004, Pages

  Wang, Zuocheng ^a   Li, Hongqi ^a   Shodiev, Hasan ^b   Suni, Ian Ivar ^a  

^a Wallace H Coulter School of Engineering   (United States)

^b CLARKSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTROCHEMISTRY; ELECTROLESS PLATING; FORMALDEHYDE; OXIDES; PHYSICAL VAPOR DEPOSITION; SILICON WAFERS; TANTALUM; X RAY SPECTROSCOPY;

DEAERATION; DIFFUSION BARRIERS; OPEN-CIRCUIT POTENTIAL (OCP); PLATING BATHS;

COPPER;

EID: 2342646167     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1667794     Document Type: Article

References (21)

1. L. Peters, Semicond. Int., 26(3), 50 (2003).
2. K. M. Takahashi, J. Electrochem. Soc., 147, 1414 (2000).
3. B. Chin, P. Ding, B. Sun, T. Chiang, D. Angelo, I. Hashim, Z. Xu, S. Edelstein, and F. Chen, Solid State Technol., 41(7), 141 (1998).
4. E. K. Broadbent, E. J. McInemy, L. A. Gochberg, and R. L. Jackson, J. Vac, Sci. Technol. B, 17, 2584 (1999).
5. E. C. Cooney, D. C. Strippe, and J. W. Korejwa, J. Vac. Sci. Technol. A, 18, 1550 (2000).
6. For a review of electrodeposition of Ta from molten salts, see A. Girginov, T. Z. Tzvetkoff, and M. Bojinov, J. Appl. Electrochem., 25, 993 (1995).
7. E. Mahe, D. Devilliers, H. Groult, and J. Pouilleau, Electrochim. Acta, 44, 2307 (1999).
8. O. Kerrec, D. Devilliers, H. Groult, and P. Marcus, Mater. Sci. Eng. B, 55, 134 (1998).
9. S. B. Basame and H. S. White, Langmuir, 15, 819 (1999).
10. Y. Shacham-Diamand and V. M. Dubin, Micrvelectron. Eng., 33, 47 (1998).
11. Z. Wang, T. Ida, H. Sakaue, S. Shingubara, and T. Takahagi, Electrochem. Solid-State Lett.. 6, C38 (2003).
12. V. M. Dubin, Y. Shacham-Diamand, C. H. Ting, B. Zhao, and P. K. Vasudev, U.S. Pat. 5,891,513 (1999).
13. L. Magagnin, R. Maboudian, and C. Carraro, Electrochem. Solid-State Lett., 4, C5 (2001).
14. L. Magagnin, R. Maboudian, and C. Carraro, J. Phys. Chem. B, 106, 401 (2002).
15. A. J. Bard, R. Parsons, and J. Jordan, Standard Potentials in Aqueous Solution, p. 535, Marcel Dekker, New York (1985).
16. ASTM International Standard D 3359-02.
17. S. Lecuyer, A. Quemerais, and G. Jezequel, Surf. Interface Anal., 18, 257 (1992).
18. P. J. S. Mangat, W. J. Dauksher, R. Whig, and W. L. O'Brien, J. Vac. Sci. Technol. A, 18, 1211 (2000).
19. A. Lasia, in Modern Aspects of Electrochemistry, Vol. 32, p. 143, B. E. Conway, Editor, Kluwer/Academic/Plenum, New York (1999).
20. O. Kerrec, D. Devilliers, H. Groult, and M. Chemla, Electrochim. Acta, 40, 719 (1995).
21. H. Li, Z. Wang, and I. I. Suni, In preparation.