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Volumn 43, Issue 9, 1998, Pages 1061-1066

Copper hydride formation in the electroless copper plating process: In situ X-ray diffraction evidence and electrochemical study

Author keywords

Copper; Copper hydride; Electroless deposition; X ray diffraction in situ

Indexed keywords

AGENTS; COPPER; DECOMPOSITION; ELECTROCHEMISTRY; ELECTROLESS PLATING; HYDROGEN; OXIDATION; REDUCTION; X RAY DIFFRACTION ANALYSIS;

EID: 0032318021     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(97)00282-X     Document Type: Article
Times cited : (40)

References (15)
  • 1
    • 0001742614 scopus 로고
    • R. M. Luhes, Plating 51, 969, 1066 (1964).
    • (1964) Plating , vol.51 , pp. 969
    • Luhes, R.M.1
  • 2
    • 0002747746 scopus 로고
    • (Edited by D. Satas), Marcel Dekker, New York
    • A. Vǎskelis, in Coatings Technology Handbook (Edited by D. Satas), p. 187, Marcel Dekker, New York (1991).
    • (1991) Coatings Technology Handbook , pp. 187
    • Vǎskelis, A.1
  • 9


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.