Cementation of copper on aluminum in alkaline solutions

Journal of the Electrochemical Society

Volumn 143, Issue 4, 1996, Pages 1300-1305

  Djokic S S ^a  

^a SHERRITT INTERNATIONAL CORPORATION   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; DISSOLUTION; FLUORESCENCE; GALVANIZING; PH; POWDERS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SODIUM COMPOUNDS; SOLUTIONS; SUBSTRATES; X RAY DIFFRACTION;

ALKALINE SOLUTION; CEMENTATION; FIRST ORDER REACTION RATE LAW; FLAT SUBSTRATES; SODIUM HYDROXIDES;

COPPER;

EID: 0030130186     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1836634     Document Type: Article

References (12)

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