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Volumn 153, Issue 9, 2006, Pages
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Nucleation characteristics of directly electrodeposited copper on TiN
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
DIFFUSION;
ELECTROCHEMISTRY;
ELECTRODEPOSITION;
ELECTROLYTES;
NUCLEATION;
PH EFFECTS;
SOLUTIONS;
COPPER SEED LAYER;
DIFFUSION BARRIER SURFACE;
ELECTRODEPOSITED COPPER;
TITANIUM NITRIDE;
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EID: 33750141291
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.2219712 Document Type: Article |
Times cited : (21)
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References (15)
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