Fabrication of nickel microbump on aluminum using electroless nickel plating

Journal of the Electrochemical Society

Volumn 144, Issue 2, 1997, Pages 471-476

  Watanabe, H ^a   Honma, H ^a,b  

^a KANTO GAKUIN UNIVERSITY   (Japan)

^b ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ELECTRODES; FABRICATION; MORPHOLOGY; NICKEL; OXIDATION;

ALUMINUM ELECTRODE; HYPOPHOSPHITE; NICKEL MICROBUMP;

ELECTROLESS PLATING;

EID: 0031078182     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1837434     Document Type: Article

References (9)

1. H. Honma and Y. Kagaya, This Journal, 140, L135 (1993).
2. H. Honma and K. Hagiwara, ibid., 142, 81 (1995).
3. T. Kawanobe, K. Miyamoto, and Y. Inaba, ibid., 149 (1981).
4. T. Kawanobe, K. Miyamoto, and M. Hirano, ibid., 221 (1983).
5. H. Honma and T. Kobayashi, Hyomen Gijutsu (J. Surf. Finish Soc. Jpn), 44, 1084 (1993).
6. H. Honma, H. Watanabe, and T. Kobayashi, This Journal, 141, 1791 (1994).
7. A. M. T. van der Putten and J-W. G. de Bakker, ibid., 140, 2221 (1993).
8. A. M. T. van der Putten and J-W. G. de Bakker, ibid., 140, 2229 (1993).
9. J. W. M. Jacobs and J. M. G. Rikken, ibid., 135, 2822 (1988).