Low temperature process for CMUT fabrication with wafer bonding technique

Proceedings - IEEE Ultrasonics Symposium

Volumn , Issue , 2010, Pages 551-554

  Tsuji, Yukihide ^a   Kupnik, Mario ^b   Khuri Yakub, Butrus T ^b  

^a NEC CORPORATION   (Japan)

^b STANFORD UNIVERSITY   (United States)

Author keywords

Capacitive micromachined ultrasonic transducer; low temperature process; monolithic integration; wafer bonding

Indexed keywords

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER; DIRECT INTEGRATION; FABRICATION PROCESS; IC SUBSTRATES; INTEGRATED ELECTRONICS; LOW TEMPERATURE WAFER BONDING; LOW-TEMPERATURE PROCESS; MONOLITHIC INTEGRATION; RESONANCE FREQUENCIES; SINGLE CRYSTAL SILICON; STANDARD DEVIATION; WAFER BONDING TECHNIQUES;

FABRICATION; INTEGRATION; MONOLITHIC INTEGRATED CIRCUITS; PLATES (STRUCTURAL COMPONENTS); RESONANCE; SILICON WAFERS; TRANSDUCERS; ULTRASONIC EQUIPMENT; ULTRASONIC MEASUREMENT; ULTRASONIC TESTING; ULTRASONIC TRANSDUCERS; ULTRASONIC WAVES; ULTRASONICS;

WAFER BONDING;

EID: 80054042630     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ULTSYM.2010.5935632     Document Type: Conference Paper

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