Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation

Journal of Materials Science and Technology

Volumn 22, Issue 1, 2006, Pages 130-134

  Liu, Chunzhong ^a,b   Chen, Ji ^a   Liu, P L ^c   Shang, Jianku ^a,c  

^a INSTITUTE OF METAL RESEARCH   (China)

^b SHENYANG AEROSPACE UNIVERSITY   (China)

^c University of Illinois at Urbana Champaign   (United States)

Author keywords

Creep; Deformation; Interconnect; Nanoindentation; Solder

Indexed keywords

AGING OF MATERIALS; BISMUTH ALLOYS; COPPER; CREEP; DEFORMATION; ELASTIC MODULI; ELECTRONICS PACKAGING; EUTECTICS; GRAIN BOUNDARIES; HARDNESS; INDENTATION; MECHANICAL PROPERTIES; MICROSTRUCTURE; MORPHOLOGY; TIN ALLOYS;

INTERCONNECTION; NANOINDENTATION; SNBI; THERMAL AGING;

SOLDERING ALLOYS;

EID: 33645021016     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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