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Journal of Materials Science: Materials in Electronics

Volumn 22, Issue 7, 2011, Pages 797-806

Influence of minor Ag nano-particles additions on the microstructure of Sn30Bi0.5Cu solder reacted with a Cu substrate

(6) Peng, Changfei a Shen, Jun a Xie, Weidong a Chen, Jie a Wu, Cuiping a Wang, Xiaochuan a

a CHONGQING UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

AIR COOLING; COMPOSITE SOLDERS; COOLING METHODS; CU SUBSTRATE; FURNACE COOLING; IMC LAYER; LEAD FREE SOLDERS; MECHANICAL MIXING METHOD; MICRO-PARTICLES; MICROSTRUCTURAL OBSERVATIONS; PHASE ANALYSIS; SOLDER JOINTS; WATER COOLING;

ADSORPTION; COOLING; INTERMETALLICS; MICROSTRUCTURAL EVOLUTION; NANOCOMPOSITE FILMS; NANOPARTICLES; PARTICLE REINFORCED COMPOSITES; SOLDERING ALLOYS; SUBSTRATES; TIN;

SILVER;

EID: 80051666684 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0214-8 Document Type: Article

Times cited : (13)

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