Electrochemical co-deposition of ternary Sn-Bi-Cu films for solder bumping applications

Journal of Applied Electrochemistry

Volumn 36, Issue 8, 2006, Pages 907-912

  Joseph, Shany ^a   Phatak, Girish J ^a   Gurunathan, K ^a   Seth, Tanay ^a   Amalnerkar, D P ^a   Kutty, T R N ^b  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

^b INDIAN INSTITUTE OF SCIENCE   (India)

Author keywords

Co deposition; Electronic packaging; Electroplating; Lead free solders; Solder bumping

Indexed keywords

CURRENT DENSITY; ELECTRONICS PACKAGING; ELECTROPLATING; EUTECTICS; SOLDERING ALLOYS; TERNARY SYSTEMS;

CO-DEPOSITION; EUTECTIC COMPOSITIONS; LEAD-FREE SOLDERS; SOLDER BUMPING;

THIN FILMS;

EID: 33746095807     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10800-006-9164-5     Document Type: Article

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