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Volumn 519, Issue 20, 2011, Pages 6721-6726
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Plasma processing of soft materials for development of flexible devices
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Author keywords
Hard X ray photoelectron spectroscopy; Inductively coupled plasma; Low inductance antenna; Low damage process; Organic inorganic device; X ray photoelectron spectroscopy
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Indexed keywords
ARGON PLASMAS;
BOND SCISSIONS;
C-H BOND;
CHEMICAL BONDING STRUCTURES;
CONJUGATED SYSTEMS;
ELECTRONIC FUNCTIONS;
FLEXIBLE DEVICE;
FUNCTIONAL LAYER;
HARD X-RAY PHOTOELECTRON SPECTROSCOPY;
INDUCTIVE COUPLINGS;
LOW-DAMAGE PROCESS;
LOW-INDUCTANCE ANTENNA;
MAIN CHAINS;
ORGANIC MATERIALS;
ORGANIC-INORGANIC;
PET FILMS;
PHENYL GROUP;
PHOTO-IRRADIATION;
PHYSICAL DAMAGES;
PLASMA EXPOSURE;
PLASMA TECHNOLOGY;
RF-POWER;
SOFT MATERIAL;
SUBSTRATE MATERIAL;
SURFACE HEATING;
SURFACE LAYERS;
TEST MATERIALS;
ANTENNAS;
ARGON;
BONDING;
CHEMICAL ANALYSIS;
CHEMICAL BONDS;
ELECTROMAGNETIC INDUCTION;
ELECTRONS;
INDUCTANCE;
INDUCTIVELY COUPLED PLASMA;
INVESTMENTS;
MATERIALS;
OXYGEN;
PHOTOELECTRICITY;
PHOTOELECTRON SPECTROSCOPY;
PHOTONS;
PLASMA INTERACTIONS;
POLYETHYLENE TEREPHTHALATES;
X RAY PHOTOELECTRON SPECTROSCOPY;
SURFACES;
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EID: 80051551024
PISSN: 00406090
EISSN: None
Source Type: Journal
DOI: 10.1016/j.tsf.2011.04.091 Document Type: Conference Paper |
Times cited : (13)
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References (21)
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