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Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 332-339

Cu Pillar and μ-bump electromigration reliability and comparison with high pb, SnPb, and SnAg bumps

(5) Syed, Ahmer a Dhandapani, Karthikeyan a Moody, Robert a Nicholls, Lou a Kelly, Mike a

a AMKOR TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BLACK'S EQUATION; BUMP METALLURGY; CU PILLAR; CURRENT LEVELS; ELECTROMIGRATION RELIABILITY; FAILURE DATA; FLIP CHIP BUMPS; FLIP CHIP SOLDER BUMP; MICROVIAS; RAPID DEVELOPMENT; SOLDER BUMP; TEST MATRIX; TEST VEHICLE; THREE TEMPERATURE;

ESTIMATION; EUTECTICS; FAILURE ANALYSIS; FLIP CHIP DEVICES; SOLDERING; SOLDERING ALLOYS; TESTING;

ELECTROMIGRATION;

EID: 79960426111 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECTC.2011.5898534 Document Type: Conference Paper

Times cited : (37)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.