Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu and Cu/Sn/Ni interconnects

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 176-181

  Chen, L D ^a   Huang, M L ^a   Zhou, S M ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGING TIME; ANODE SIDE; ATOMIC FLUXES; BULK SOLDER; CRITICAL FACTORS; CRITICAL THICKNESS; CU ATOMS; CU CONTENT; CURRENT CROWDING EFFECT; DIFFUSIVITIES; ELECTRON FLOW; ELECTRON WIND; GROWTH BEHAVIOR; HIGHER TEMPERATURES; IN-LINE; INTERFACIAL INTERMETALLICS; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; NI ATOMS; ORDERS OF MAGNITUDE; POLARITY EFFECT; SYMMETRIC STRUCTURES; THERMOMIGRATION;

ATOMS; BIOACTIVITY; CURRENT DENSITY; ELECTROMIGRATION; ELECTRONS; GROWTH KINETICS; SOLDERING ALLOYS; TIN;

SEMICONDUCTING INTERMETALLICS;

EID: 77955218359     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490898     Document Type: Conference Paper

References (11)

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