Factors affecting electromigration and current carrying capacity of FC and 3D IC interconnects

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 538-544

  Syed, Ahmer ^a  

^a AMKOR TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT CARRYING CAPACITY; DATA COLLECTION; DIRECT IMPACT; FAILURE CRITERIA; FINE PITCH; FLIP CHIP BUMPS; INTERCONNECT STRUCTURES; MICROVIAS; RAPID DEVELOPMENT; SIGNIFICANT IMPACTS; SOLDER ALLOYS; SURFACE FINISHES; TEST DESIGNS; TEST STRUCTURE;

ELECTROMIGRATION; ELECTRONIC EQUIPMENT MANUFACTURE; FLIP CHIP DEVICES; IMPACT RESISTANCE; LEAD; METALLURGY; RELIABILITY; THREE DIMENSIONAL;

CHIP SCALE PACKAGES;

EID: 79951870241     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702698     Document Type: Conference Paper

References (11)

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