Analysis of electromigration for Cu pillar bump in flip chip package

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 129-133

  Yoo, Jae Hyouk ^a   Kang, In Soo ^a   Jung, Gi Jo ^a   Kim, Sungdong ^b   Ahn, Hyo Sok ^b   Choi, Won Ho ^b   Jun, Ki Sung ^b   Jang, Doo Wool ^b   Baek, In Hong ^b   Yu, Joo Nam ^b  

^a NEPES Corporation   (South Korea)

^b Seoul National University of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CU PILLAR; DISTRIBUTION ANALYSIS; ELECTROMIGRATION FAILURES; ELECTROMIGRATION RELIABILITY; FLIP-CHIP PACKAGES; HIGH CURRENT DENSITIES; IC PACKAGING; JOULE HEAT; MEAN TIME TO FAILURE; SMALL FORM FACTORS; SOLDER BUMP; UNDER BUMP METALLIZATION; WEIBULL;

APPROXIMATION THEORY; CURRENT DENSITY; ELECTROMIGRATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; QUALITY ASSURANCE; WEIBULL DISTRIBUTION;

PACKAGING;

EID: 79951900622     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702620     Document Type: Conference Paper

References (3)

1. th Electronic Components and Technology Conference, San Dieho, CA, May 2009, pp. 948-953.
2. B. J. Kim. & et al., "Microstructure Evolution in Cu Pillar/Eutectic SnPb Solder System during Isothermal Annealing", Met. Mater. Int., Vol. 15, No. 5 (2009), pp. 815-818
3. S. H. Chae. & et al., "Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages", J. Mater. Sci., Mater Electron(2007) Vol.18, pp. 247-258