Pulsed plasma enhanced chemical vapor deposition of alumina thin films: Influence of the duty cycle on structure and elastic properties

Plasma Processes and Polymers

Volumn 8, Issue 7, 2011, Pages 651-657

  Konstantinidis, Stephanos ^a,b   Jiang, Kaiyun ^a   Roobroek, Aline ^c   Renaux, Fabian ^c   Schneider, Jochen M ^a  

^a RWTH AACHEN UNIVERSITY   (Germany)

^b UNIVERSITY OF MONS   (Belgium)

^c MATERIA NOVA RESEARCH CENTER   (Belgium)

Author keywords

alumina; duty cycle; hardness; pulsed discharges; thin films

Indexed keywords

A-DENSITY; ALUMINA COATING; ALUMINA THIN FILMS; BULK DENSITY; CHLORINE CONTENT; DEPOSITED MATERIALS; DEPOSITION METHODS; DUTY CYCLE; DUTY CYCLES; ELASTIC PROPERTIES; FILM SURFACES; ION FLUXES; PULSED DISCHARGE; PULSED PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

CHLORINE; COATINGS; DEPOSITION; DESORPTION; ELASTIC MODULI; ELECTRIC DISCHARGES; FILM GROWTH; ION BOMBARDMENT; IONS; OPTICAL FILMS; PLASMA DEPOSITION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THIN FILMS;

CHEMICAL VAPOR DEPOSITION;

EID: 79960211526     PISSN: 16128850     EISSN: 16128869     Source Type: Journal    
DOI: 10.1002/ppap.201000185     Document Type: Article

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