A sequential tensile method for rapid characterization of extreme-value behavior in microfabricated materials

Proceedings of the Society for Experimental Mechanics, Inc.

Volumn 67, Issue , 2010, Pages 993-997

  Boyce, B L ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Fracture; MEMS; Silicon; Strength; Weibull

Indexed keywords

CONVENTIONAL MATERIALS; CUT-OFF; DATA SETS; FLAW SIZE DISTRIBUTION; FRACTURE STRENGTHS; HIGH-THROUGHPUT; MECHANICAL TESTS; MICRO TENSILE TESTS; MICROFABRICATED; POLY-CRYSTALLINE SILICON; SEQUENTIAL METHODS; STRENGTH; STRENGTH DISTRIBUTION; TENSILE FAILURES; TENSILE METHOD; TENSILE TESTS; THREE-PARAMETER WEIBULL; THRESHOLD STRESS; WEIBULL;

BENDING STRENGTH; BENDING TESTS; CHARACTERIZATION; COMPOSITE MICROMECHANICS; FRACTURE TOUGHNESS; MATERIALS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROFABRICATION; POLYCRYSTALLINE MATERIALS; POLYSILICON; STATISTICAL TESTS; TENSILE STRENGTH; TENSILE TESTING; WEIBULL DISTRIBUTION;

FRACTURE;

EID: 79960053527     PISSN: 10466789     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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