Flexible polyimide micropump fabricated using hot embossing

Japanese Journal of Applied Physics

Volumn 50, Issue 6 PART 2, 2011, Pages

  Komatsuzaki, Hiroki ^a   Suzuki, Kenta ^a   Liu, Yingwei ^a   Kosugi, Tatsuya ^a   Ikoma, Ryuta ^a   Youn, Sung Won ^b   Takahashi, Masaharu ^b   Maeda, Ryutaro ^b   Nishioka, Yasushiro ^a  

^a NIHON UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AIR PRESSURES; DIFFUSER/NOZZLE; FLEXIBLE POLYIMIDE; HIGH THERMAL STABILITY; HOT-EMBOSSING; MICRO FLUIDIC SYSTEM; MICRO PUMP; PI FILM;

ATMOSPHERIC PRESSURE; FLUIDIC DEVICES; MECHANICAL PROPERTIES; MICROFLUIDICS; POLYIMIDES;

PUMPS;

EID: 79959469372     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.50.06GM09     Document Type: Article

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