Micro press molding of borosilicate glass using plated Ni-W molds

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 46, Issue 9 B, 2007, Pages 6378-6381

  Yasui, Manabu ^a   Takahashi, Masaharu ^b   Kaneko, Satoru ^a   Tsuchida, Tomoyuki ^c   Hlrabayashi, Yasuo ^a   Sugimoto, Kohichi ^d   Uegaki, Jun Ichi ^c   Maeda, Ryutaro ^b  

^a KANAGAWA ACADEMY OF SCIENCE AND TECHNOLOGY   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^c Elionix Inc   (Japan)

^d SHINSHU UNIVERSITY   (Japan)

Author keywords

Borosilicate glass; FIB; Glass pattern; Hot embossing; Ni W; Submicron or micron size

Indexed keywords

CHEMICAL REACTORS; MICROPROCESSOR CHIPS; THERMAL EFFECTS;

GLASS PATTERN; HOT EMBOSSING;

BOROSILICATE GLASS;

EID: 34648829964     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.46.6378     Document Type: Article

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