Mitigating the geometrical limitations of conventional sputtering by controlling the ion-to-neutral ratio during high power pulsed magnetron sputtering

Thin Solid Films

Volumn 519, Issue 19, 2011, Pages 6354-6361

  Greczynski, G ^a   Jensen, J ^a   Hultman, L ^a  

^a LINKÖPING UNIVERSITY   (Sweden)

Author keywords

Chromium; High power impulse magnetron sputtering; High power pulsed magnetron sputtering; Ionized physical vapor deposition

Indexed keywords

BIAXIAL ALIGNMENT; CHROMIUM LAYER; CONVENTIONAL SPUTTERING; FIBER TEXTURE; FLUX RATIO; HIGH POWER PULSED MAGNETRON SPUTTERING; HIGH-POWER; HIGHLY-IONIZED; IN-PLANE ALIGNMENT; INCLINATION ANGLES; ION CONTENT; IONIZED PHYSICAL VAPOR DEPOSITION; LINE-OF-SIGHT DEPOSITION; MATERIAL FLUXES; RECTANGULAR SHAPES; SPUTTERED SPECIES; SUBSTRATE ORIENTATION;

ALIGNMENT; CHROMIUM; ELECTRIC FIELDS; FACINGS; FILM GROWTH; IONIZATION; IONS; MAGNETRON SPUTTERING; PHYSICAL VAPOR DEPOSITION; TEXTURES;

SUBSTRATES;

EID: 79958236524     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.04.031     Document Type: Article

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