Towards thermally-aware design of 3D MPSoCs with inter-tier cooling

Proceedings -Design, Automation and Test in Europe, DATE

Volumn , Issue , 2011, Pages 1466-1471

  Sabry, Mohamed M ^a   Sridhar, Arvind ^a   Atienza, David ^a   Temiz, Yuksel ^a   Leblebici, Yusuf ^a   Szczukiewicz, Sylwia ^a   Borhani, Navid ^a   Thome, John R ^a   Brunschwiler, Thomas ^b   Michel, Bruno ^b  

^a EPFL   (Switzerland)

^b IBM   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING ENERGY; COOLING MECHANISM; COOLING TECHNOLOGY; DESIGN PARADIGM; DYNAMIC THERMAL MANAGEMENT; ELECTRICAL POWER; ENERGY CONSTRAINT; ENERGY EFFICIENT; ENVIRONMENTALLY-FRIENDLY; FUNCTIONAL UNITS; HIGH PERFORMANCE COMPUTING SYSTEMS; LIQUID COOLING SYSTEMS; LIQUID WATER; MANAGEMENT STRATEGIES; MAXIMUM VALUES; MULTI PROCESSOR SYSTEM ON CHIPS; NANO-SIZED; NANOFLUIDS; NEW TENDENCIES; POWER DENSITIES; RUNTIMES; SYSTEM LEVEL DESIGN; SYSTEM LEVELS; THERMAL CONTROL; THERMAL MODELING; THRESHOLD TEMPERATURES;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; COMMUNICATION SYSTEMS; COMPUTER SOFTWARE SELECTION AND EVALUATION; COOLANTS; COOLING; COOLING SYSTEMS; DESIGN; FLOW RATE; LIQUIDS; MICROPROCESSOR CHIPS; PUMPS; TEMPERATURE CONTROL;

THREE DIMENSIONAL;

EID: 79957557005     PISSN: 15301591     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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