RF/wireless-interconnect: The next wave of connectivity

Science China Information Sciences

Volumn 54, Issue 5, 2011, Pages 1026-1038

  Tam, Sai Wang ^a   Chang, Mau Chung Frank ^a  

^a University of California   (United States)

Author keywords

3 dimensional integrated circuit; Advanced memory interface; Multi band; Network on chips; RF interconnect; Wireless contactless connector; Wireless RF interconnect

Indexed keywords

EID: 79955819850     PISSN: 1674733X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11432-011-4225-8     Document Type: Review

References (24)

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