Multi-design of architecture, circuit/device/process and package for cost-effective smart mobile devices: An integrated fabless manufacturer (IFM)'s perspective

Digest of Technical Papers - Symposium on VLSI Technology

Volumn , Issue , 2010, Pages 223-224

  Yeap, Geoffrey C F ^a  

^a QUALCOMM INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 77957863429     PISSN: 07431562     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/VLSIT.2010.5556236     Document Type: Conference Paper

References (9)

1. S-J Chen et al., Hardware Software Co-Design of a Multimedia SOC Platform, Springer, 2009.
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3. M. Fukuma, "New Frontiers of sub-100nm VLSI Tech - Moving towards Device and Circuit Co-Design", VLSI Tech Sym., 2000.
4. G. Yeap et al, VLSI Tech Sym., p. 16, 2002.
5. G. Gammie et al, Procs IEEE, p.144, Feb 2010.
6. K. Uchiyama, VLSI Circuits, p. 6, 2008.
7. P. Liu et al, accepted to VLSI Tech Sym., 2010.
8. S. Gu et al, IEDM, p. 813, 2008.
9. M. Facchini et al., DATE, April 2009.