Electroplated nickel permanent magnetic films over polymeric membranes

Journal of the Electrochemical Society

Volumn 158, Issue 6, 2011, Pages

  Campos, C D M ^a   Flacker, A ^a,b   Vaz, A R ^a   Moshkalev, S A ^a   Nobrega, E G O ^a  

^a UNIVERSITY OF CAMPINAS   (Brazil)

^b Renato Archer Center of Information Technology   (Brazil)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITED FILMS; DIFFERENT PROCESS; ELECTROLESS CONTACTS; ELECTROPLATED LAYERS; ELECTROPLATED NICKEL; ENERGY PRODUCTS; FLEXIBLE MEMBRANES; NICKEL FILM; PERMANENT MAGNETIC FILMS; POLYMERIC SUBSTRATE; PRE-TREATMENT; PROCESS PARAMETERS; PROPERTIES OF DEPOSITED FILMS;

ELECTROPLATING; MAGNETIC DEVICES; MAGNETIC FIELDS; MAGNETIC PROPERTIES; MECHANICAL PROPERTIES; METALLIC FILMS; NICKEL; NICKEL PLATING; PERMANENT MAGNETS; POLYMERIC MEMBRANES; POLYMERS; SURFACE ROUGHNESS;

POLYMERIC FILMS;

EID: 79955541350     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3571035     Document Type: Article

References (56)

1. L. O'Connor, Mech. Eng. (Am. Soc. Mech. Eng.), 114, 40 (1992).
2. P. Nandi, D. P. Desai, and S. M. Lunte, Electrophoresis, 31, 1414 (2010). 10.1002/elps.200900612
3. M. Zhu, P. Kirby, M. Wacklerle, M. Herz, and M. Richter, Sens. Actuators A, 149, 130 (2009). 10.1016/j.sna.2008.10.009
4. H. T. Chang, C. Y. Lee, C. Y. Wen, and B. S. Hong, Microelectron. J., 38, 791 (2007). 10.1016/j.mejo.2007.04.013 (Pubitemid 47189576)
5. Y. H. Wang, Y. M. Tsai, C. H. Tsai, C. Y. Lee, and L. M. Fu, Sensors, 10, 4040 (2010). 10.3390/s100404040
6. J. W. Judy and R. S. Muller, J. Microelectromech. Syst., 6, 249 (1997). 10.1109/84.623114
7. H. J. Cho and C. H. Ahn, J. Microelectromech. Syst., 11, 78 (2002). 10.1109/84.982866 (Pubitemid 34277081)
8. M. L. Munford, M. L. Sartorelli, L. Seligman, and A. A. Pasa, J. Electrochem. Soc., 149, C270 (2002). 10.1149/1.1468646 (Pubitemid 34599584)
9. Y. Su, H. Wang, and W. Chen, Proc. Inst. Mech. Eng., IMechE Conf., 222, 517 (2008). 10.1243/09544062JMES596 (Pubitemid 351662975)
10. C. Shen, W. Huang, and G. Ma, X. Wang, Surf. Coat. Technol., 204, 433 (2009). 10.1016/j.surfcoat.2009.08.003
11. G. Wei, H. Ge, L. Huang, Q. Wu, X. Wang, and L. Huang, Appl. Surf. Sci., 254, 3425 (2008). 10.1016/j.apsusc.2007.11.038
12. C. Y. Pan, Microsyst. Technol., 11, 1 (2005). 10.1007/s00542-004-0410-7 (Pubitemid 40003503)
13. H. S. Chang, C. Y. Wen, and C. Y. Lee, J. Micromech. Microeng., 19, 085026 (2009). 10.1088/0960-1317/19/8/085026
14. H. T. Chang, C. Y. Lee, C. Y. Wen, and B. S. Hong, Microelectron. J., 38, 791 (2007). 10.1016/j.mejo.2007.04.013 (Pubitemid 47189576)
15. K. H. J. Buschow, Handbook of Magnetic Materials, p. 410, Elsevier, Amsterdam (1997). 10.1016/S1567-2719(09)01801-0
16. E. Gmes, S. Pané, and E. Vallés, Electrochem. Commun., 7, 1225 (2005). 10.1016/j.elecom.2005.08.016 (Pubitemid 41660177)
17. S. Kulkarni, S. Roy, T. O'Donnell, S. Beeby, and J. Tudor, J. Appl. Phys., 99, 08P511 (2006). 10.1063/1.2176089
18. S. Guan and B. J. Nelson, Sens. Actuators A: Phys., 118, 307 (2005). 10.1016/j.sna.2004.08.020 (Pubitemid 40183494)
19. W. Ruythooren, K. Attenborough, S. Beerten, and P. Merken, J. Micromech. Microeng., 10, 101 (2000). 10.1088/0960-1317/10/2/301
20. M. Hans, R. Bchel, M. Grischke, R. Hobi, and M. Zch, Surf. Coat. Technol., 123, 288 (2000). 10.1016/S0257-8972(99)00477-6 (Pubitemid 30244777)
21. T. Chen and P. L. Cavallotti, IEEE Trans. Magn., 18, 1125 (1982). 10.1109/TMAG.1982.1062217
22. T. Chen and P. L. Cavallotti, Appl. Phys. Lett., 41, 205 (1982). 10.1063/1.93463
23. P. L. Cavallotti, D. Colombo, E. Gabiati, and R. Martinella, Proc. Interfinish, Int Lts., Tel Aviv, Israel, 84, 234 (1984).
24. J. Horkans, D. J. Seagle, and C. H. Chang, J. Electrochem. Soc., 137, 2056 (1990). 10.1149/1.2086864
25. H. J. Cho, S. Bhansali, and C. H. Ahn, J. Appl. Phys., 87, 6340 (2000). 10.1063/1.372699
26. T. M. Liakopoulos, W. Zhang, and C. H. Ahn, in Proceedings of IEEE 9th International Workshop in MEMS, IEEE, Piscataway, NJ, p. 74 (1996).
27. E. Brillas, J. Rambla, and J. Casado, J. Appl. Electrochem., 29, 1367 (1999). 10.1023/A:1003852924383 (Pubitemid 30546653)
28. J. Leon, A. Flacker, A. R. Vaz, C. Verissimo, M. B. De Moraes, and S. A. Moshkalev, J. Nanosci. Nanotechnol., 10, 1 (2010). 10.1166/jnn.2010.2585
29. S. L. Chen and H.C. Peng, J. Electrochem. Soc., 157, D81 (2010). 10.1149/1.3263266
30. J. N. Balaraju, T. S. N. S. Narayanan, and S. K. Seshadri, J. Appl. Electrochem., 33, 07 (2003). 10.1023/A:1025572410205
31. S. Hamdy, M. A. Shoeib, H. Hady, and O. F. A. Salam, J. Appl. Electrochem., 38, 385 (2008). 10.1007/s10800-007-9451-9
32. G. J. Lu and G. Zangari, Electrochim. Acta, 47, 2969 (2002). 10.1016/S0013-4686(02)00198-6 (Pubitemid 34704363)
33. E. G. O. Nbrega and C. D. M. Campos, ABCM Symposium Series in Mechatronics, ABCM, Rio de Janeiro, Brazil, 3, p. 586, 2008.
34. G. G. Gawrilov, Chemical (Electroless) Nickel-Plating, pp. 16-17, Portcullis, United Kingdom (1979).
35. J. W. Severin, R. Hokke, H. Van Der Vel, and G. With, J. Electrochem. Soc., 140, 682 (1983). 10.1149/1.2056142
36. D. J. Monk and D. S. Soane, Thin Solid Films, 232, 1 (1993). 10.1016/0040-6090(93)90752-B
37. V. M. Dubin, D. Lopatin, and V. G. Sokolov, Thin Solid Films, 226, 94 (1993). 10.1016/0040-6090(93)90211-7 (Pubitemid 23639817)
38. J. K. Dennis and T. E. Such, Nickel and Cromium Plating, p. 87, Woodhead Publishing, Cambridge, UK (1993).
39. O. Rotlevi, S. D. Dobson, D. Rose, and G. Hodes, Thin Solid Films, 387, 155 (2001). 10.1016/S0040-6090(00)01738-7 (Pubitemid 32272943)
40. J. R. Davis, Nickel Cobalt and their Alloys, p. 108, ASM International, USA (2000).
41. Astm D3359, Standard Test Methods For Measuring Adhesion By Tape Test (2008).
42. R. M. Silverstein, F. X. Webster, and D. J. Kiemle, Spectrometric Identification of Organic Compounds, pp. 1-502, John Wiley Sons, New York (2005).
43. L. Wu, B. You, and D. Li, J. Appl. Polym. Sci., 84, 1620 (2002). 10.1002/app.v84:8
44. F. Masson, C. Decker, T. Jaworek, and R. Schwalm, Prog. Org. Coat., 39, 115 (2000). 10.1016/S0300-9440(00)00128-4 (Pubitemid 32029791)
45. L. Zhu and N. M. Kostic, J. Am. Chem. Soc., 115, 4566 (1993). 10.1021/ja00064a019
46. J. C. Shannon, Z. H. Gu, and T. Z. Fahidy, J. Electrochem. Soc., 144, L314 (1997). 10.1149/1.1838144
47. L. Cifuentes, M. Artigas, G. Riveros, and A. Warczog, Rev. Metalurgia, 39, 304 (2003). 10.3989/revmetalm.2003.v39.i4.342
48. C. Y. Lee, H. T. Chang, and C. Y. Wen, J. Micromech. Microeng., 18, 035044 (2008). 10.1088/0960-1317/18/3/035044 (Pubitemid 351591326)
49. W. K. Chen, The Electrical Engineering Handbook, p. 490, Elsevier, Eua, New York (2005).
50. Basak, Permanent Magnet DC Linear Motors, p. 47, Oxford, United Kingdom, 2002.
51. T. Z. Fahidy and T. S. Rutherford, J. Appl. Electrochem., 10, 481 (1980). 10.1007/BF00614081
52. V. Ganesh, D. Vijayaraghavan, and V. Lakshminarayanan, Appl. Surf. Sci., 240, 286 (2005). 10.1016/j.apsusc.2004.06.139
53. N. V. Myung, D. Y. Park, B. Y. Yoo, and P. T. A. Sumodjo, J. Magn. Magn. Mater., 265, 189 (2003). 10.1016/S0304-8853(03)00264-6
54. L. Zhang, C. Zhang, and T. Shi, Adv. Mater. Res., 139-141, 1574 (2010). 10.4028/www.scientific.net/AMR.142.139
55. C. Y. Lee and Z. H. Chen, Biomed. Microdevices, 12, 197 (2010). 10.1007/s10544-009-9375-8
56. M. Shen, L. Dovat, and M. A. M. Gijs, Sens. Actuators., In press.