Residual stresses of sputtering Titanium thin films at various substrate temperatures

Journal of Nanoscience and Nanotechnology

Volumn 10, Issue 7, 2010, Pages 4562-4567

  Chang, R C ^a   Chen, F Y ^b   Chuang, C T ^a   Tung, Y C ^a  

^a ST JOHN'S UNIVERSITY   (Taiwan)

^b LEE MING INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Mechanical Properties; Residual Stresses; Sputtering; Thin Films

Indexed keywords

DIFFERENT SUBSTRATES; NANOINDENTERS; RF MAGNETRONS; SPUTTERING PROCESS; STRESS CHANGES; STRESS DECREASE; SUBSTRATE CURVATURE; SUBSTRATE TEMPERATURE; TITANIUM THIN FILMS; VARIOUS SUBSTRATES;

MAGNETRONS; NANOINDENTATION; RESIDUAL STRESSES; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; THIN FILMS; TITANIUM; X RAY DIFFRACTION;

MECHANICAL PROPERTIES;

EID: 79955377910     PISSN: 15334880     EISSN: None     Source Type: Journal    
DOI: 10.1166/jnn.2010.1696     Document Type: Conference Paper

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