Effects of internal stresses on the mechanical properties of deposition thin films

Journal of Materials Processing Technology

Volumn 201, Issue 1-3, 2008, Pages 770-774

  Chuang, C T ^a   Chao, C K ^b   Chang, R C ^a   Chu, K Y ^b  

^a ST JOHN'S UNIVERSITY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Internal stresses; Mechanical properties; Nanoindentation; Thin films

Indexed keywords

DEPOSITION; ELASTIC MODULI; EVAPORATION; NANOINDENTATION; RESIDUAL STRESSES; SILICON WAFERS;

EVAPORATION DEPOSITION; TITANIUM THIN FILMS;

THIN FILMS;

EID: 41549145303     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2007.11.258     Document Type: Article

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