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Volumn 7, Issue 11, 2007, Pages 4081-4083
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Stress behavior of FCC metallic thin films during thermal evaporation
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Author keywords
Evaporation; Flux; Intrinsic Stress; Thin Film
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Indexed keywords
(1 1 0) SURFACE;
(ABIOTIC AND BIOTIC) STRESS;
CURVATURE (SORI);
CURVATURE MEASUREMENTS;
DEPOSITION TIME;
EXCESS VOLUMES;
EXPERIMENTAL SET UPS;
HIGH MOBILITY MATERIALS;
IN-SITU;
LASER REFLECTION;
MAXIMUM STRESS;
METALLIC ATOMS;
METALLIC THIN FILMS;
MULTIBEAM (CO);
STONEY'S FORMULA;
STRESS BEHAVIOR;
STRESS LEVELS;
SURFACE STATES;
TENSILE REGION;
THIN FILM SURFACES;
VACUUM THERMAL EVAPORATION (VTE);
AGRICULTURAL PRODUCTS;
ATOMIC PHYSICS;
ATOMS;
CHEMICAL VAPOR DEPOSITION;
COMPRESSIVE STRESS;
COPPER;
CRYSTAL GROWTH;
EVAPORATION;
FILM GROWTH;
FILM THICKNESS;
GRAIN BOUNDARIES;
HETEROJUNCTIONS;
LASERS;
METALLIC SOAPS;
MOISTURE;
PULSED LASER DEPOSITION;
SILVER;
SOLIDS;
SURFACES;
TENSILE STRESS;
THERMAL EVAPORATION;
THICK FILMS;
THIN FILMS;
VACUUM EVAPORATION;
VAPORS;
MOLECULAR BEAM EPITAXY;
GOLD;
NANOMATERIAL;
SILVER;
ARTICLE;
ARTIFICIAL MEMBRANE;
CHEMISTRY;
CONFORMATION;
CRYSTALLIZATION;
ELASTICITY;
GAS;
HEAT;
MACROMOLECULE;
MATERIALS TESTING;
MECHANICAL STRESS;
METHODOLOGY;
NANOTECHNOLOGY;
PARTICLE SIZE;
PHASE TRANSITION;
SURFACE PROPERTY;
TEMPERATURE;
ULTRASTRUCTURE;
CRYSTALLIZATION;
ELASTICITY;
GASES;
GOLD;
HEAT;
MACROMOLECULAR SUBSTANCES;
MATERIALS TESTING;
MEMBRANES, ARTIFICIAL;
MOLECULAR CONFORMATION;
NANOSTRUCTURES;
NANOTECHNOLOGY;
PARTICLE SIZE;
PHASE TRANSITION;
SILVER;
STRESS, MECHANICAL;
SURFACE PROPERTIES;
TEMPERATURE;
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EID: 38449104233
PISSN: 15334880
EISSN: None
Source Type: Journal
DOI: 10.1166/jnn.2007.089 Document Type: Conference Paper |
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Times cited : (10)
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References (14)
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