Residual stress and structural characteristics in Ti and Cu sputtered films on glass substrates at different substrate temperatures and film thickness

Physica B: Condensed Matter

Volumn 349, Issue 1-4, 2004, Pages 44-55

  Savaloni, Hadi ^a   Taherizadeh, Ali ^b   Zendehnam, Akbar ^b  

^a UNIVERSITY OF TEHRAN   (Iran)

^b ARAK UNIVERSITY   (Iran)

Author keywords

Residual stress; Stress tensor; Thin Ti and Cu films; X ray diffraction

Indexed keywords

COATINGS; COPPER; CRYSTAL ORIENTATION; CRYSTALLOGRAPHY; GLASS; MAGNETRON SPUTTERING; MATHEMATICAL MODELS; MICROSTRUCTURE; PHYSICAL VAPOR DEPOSITION; POLYCRYSTALLINE MATERIALS; RESIDUAL STRESSES; SUBSTRATES; TENSORS; THICK FILMS; X RAY DIFFRACTION;

POLYCRYSTALLINE FILMS; STRESS TENSORS; STRUCTURE ZONE MODEL (SZM); THIN TI AND CU FILMS;

TITANIUM;

EID: 2942585324     PISSN: 09214526     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.physb.2004.01.158     Document Type: Article

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