Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Journal of Micromechanics and Microengineering

Volumn 20, Issue 4, 2010, Pages

  Okoro, Chukwudi ^a,b   Vanstreels, Kris ^a   Labie, Riet ^a   Lühn, Ole ^a,b   Vandevelde, Bart ^a   Verlinden, Bert ^b   Vandepitte, Dirk ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING CONDITION; COMPETITIVE EFFECTS; CRYSTALLOGRAPHIC TEXTURES; E-MODULUS; GRAIN SIZE; GRAIN SIZE EFFECT; HALL-PETCH RELATION; HARDNESS VALUES; MECHANICAL BEHAVIOR; MICRO-STRUCTURAL; ROOM TEMPERATURE; TEST CONDITION;

ANNEALING; GRAIN SIZE AND SHAPE; RESIDUAL STRESSES;

HARDNESS;

EID: 77949876668     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/4/045032     Document Type: Article

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