Elimination of the axial deformation problem of Cu-TSV in 3D integration

AIP Conference Proceedings

Volumn 1300, Issue , 2010, Pages 214-220

  Okoro, Chukwudi ^a,b   Huyghebaert, Cedric ^a   Van Olmen, Jan ^a   Labie, Riet ^a   Lambrinou, Konstantza ^a   Vandevelde, Bart ^a   Beyne, Eric ^a   Vandepitte, Dirk ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

AFM; BEOL; out of plane expansion; TSV; Wafer Curvature Method

Indexed keywords

EID: 79251591015     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3527128     Document Type: Conference Paper

References (6)

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4. J. Van Olmen et al, 3D Stacked IC Demonstrator using Hybrid Collective Die-to- Wafer Bonding with Copper Through Silicon Vias (TSV), IEEE IEDM, Dec. 2008, San Francisco, CA, USA, pp.603-606.
5. Y. L. Shen et al, J. Vac. Sci. Technology B 21 (4), 1258-1264 (2003).
6. D. S. Gardner et al, IEEE Trans. Electron Devices, 35 (12), 2160-2169 (2008).