Filling of microvia with an aspect ratio of 5 by copper electrodeposition

Electrochimica Acta

Volumn 54, Issue 9, 2009, Pages 2504-2508

  Luhn O ^a,b   Van Hoof, C ^a,b   Ruythooren, W ^b   Celis, J P ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b IMEC   (Belgium)

Author keywords

Additives; Bottom up; Copper; Leveler; Superfilling

Indexed keywords

COPPER; ELECTRODEPOSITION; PRESSURE DROP; SCANNING ELECTRON MICROSCOPY;

BOTTOM-UP; BOTTOM-UP FILLS; BULK ELECTROLYTES; CONCENTRATION OF; COPPER ELECTRODEPOSITIONS; COPPER ELECTROPLATING; FILLING EXPERIMENTS; LEVELER; MICROVIA; MICROVIAS; PLATING RATES; POTENTIODYNAMIC POLARIZATION MEASUREMENTS; RATE INCREASE; SUPERFILLING;

ASPECT RATIO;

EID: 60949091043     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2008.04.002     Document Type: Article

References (18)

1. Beyne E.S. Proceedings of the International Symposium on VLSI Technology, Systems and Applications. Hsinhu, April 24-26 (2006) 19
2. Beyne E. Proceedings of the IEEE International Interconnect Technology Conference. Burlingame, June 4-7 (2006) 1
3. Swinnen B., Ruythooren W., De Moor P., Bogaerts L., Carbonell L., De Munck K., Eyckens B., Stoukatch S., Sabuncuoglu Tezcan D., Tokei Z., Vaes J., Van Aelst J., and Beyne E. Proceedings of the International Electron Devices Meeting (IEEE IEDM 2006). San Francisco, December 11-13 (2006) 1
4. Moffat T.P., Wheeler D., Edelstein M., and Josell D. IBM J. Res. Dev. 49 (2005) 19
5. Watson S.A., and Edwards J. Trans. Inst. Met. Finish. 34 (1957) 167
6. Madore C., Matlosz M., and Landolt D. J. Electrochem. Soc. 143 12 (1996) 3927
7. Madore C., and Landolt D. J. Electrochem. Soc. 143 12 (1996) 3936
8. Chang C.C., and West A.C. J. Electrochem. Soc. 144 9 (1997) 3050
9. Kim B., Sharbono C., Ritzdorf T., and Schmauch D. Proceedings of the IEEE Electronic Components and Technology Conference. San Diego, 30 May-2 June (2006) 838
10. Dow W.-P., Yen M.-Y., Lin W.-B., and Ho S.-W. J. Electrochem. Soc. 152 11 (2005) C769
11. Dow W.-P., and Liu C.-W. J. Electrochem. Soc. 153 3 (2006) C190
12. Moffat T., Wheeler D., and Jossel D. J. Electrochem. Soc. 151 4 (2004) C262
13. Dow W.-P., and Huang H.-S. J. Electrochem. Soc. 152 2 (2005) C67
14. Lühn O., Celis J.-P., Van Hoof C., Baert K., and Ruythooren W. ECS Trans. 6 8 (2007) 123
15. Patten J.W., McClanahan E.D., and Johnston J.W. J. Appl. Phys. 42 11 (1971) 4371
16. Roha D., and Landau U. J. Electrochem. Soc. 137 3 (1990) 824
17. Fischer H. Electrodeposit. Surf. Treat. 1 (1972/73) 239
18. Fischer H. Electrodeposit. Surf. Treat. 1 (1972/73) 319