MSA as a supporting electrolyte in copper electroplating for filling of damascene trenches and through silicon vias

Electrochemical and Solid-State Letters

Volumn 14, Issue 5, 2011, Pages

  Cho, Sung Ki ^a,b   Kim, Myung Jun ^a   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

^b Center for Electrochemistry   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ELECTROPLATING; COPPER IONS; I-V BEHAVIOR; METHANE SULFONIC ACID; SOLUTION RESISTANCE; SUPPORTING ELECTROLYTE; THROUGH SILICON VIAS; VOLTAMETRY;

COPPER; ELECTROLYTES; FILLING; METAL IONS; SOLUBILITY;

SULFURIC ACID;

EID: 79952523893     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3557758     Document Type: Article

References (29)

1. J. S. Newman, Electrochemical Systems, 2nd ed., p. 331, Prentice-Hall, Englewood Cliffs, New Jersey (1991).
2. J. Reid, Jpn. J. Appl. Phys., 40, 2650 (2001). 10.1143/JJAP.40.2650
3. J. W. Dini, in Modern Electroplating, M. Schlesinger and M. Paunovic, Editors, 4th ed., p. 61, John Wiley Sons, New York (2000).
4. Q. Li, H. Ling, H. Cao, Z. Bian, M. Li, and D. Mao, in Proceedings of the International Conference on Electronic Packaging Technology and High Density Packaging, p. 68, IEEE, New York (2009).
5. J. Reid, Abstract 1992, The Electrochemical Society Meeting Abstracts, Vol. 2010, Las Vegas, NV, Oct 10-15, 2010.
6. M. D. Gernon, M. Wu, T. Buszta, and P. Janney, Green Chem., 1, 127 (1999). 10.1039/a900157c
7. L. R. Barstad, J. E. Rychwalski, M. Lefebvre, S. Menard, J. L. Martin, R. A. Schetty, and M. Toben, U.S. Pat. 6,444,110 (2002).
8. N. M. Martyak, M. D. Gernon, and P. Janney, U.S. Pat. 6,605,204 B1 (2003).
9. G. Bokisa, U.S. Pat. 6,676,823 (2004).
10. C. T. J. Low and F. C. Walsh, Surf. Coat. Technol., 202, 3050 (2008). 10.1016/j.surfcoat.2007.11.005 (Pubitemid 351722761)
11. M. Hasan and J. F. Rohan, J. Electrochem. Soc., 157, D278 (2010). 10.1149/1.3332729
12. J. J. Kim, S. K. Cho, K. J. Park, M. J. Kim, and H.-C. Koo, Abstract 992, The Electrochemical Society Meeting Abstracts, Vol. 2009, San Francisco, CA, May 24-29, 2009.
13. M. Ramasubramanian, B. N. Popov, R. E. White, and K. S. Chen, J. Appl. Electrochem., 28, 737 (1998). 10.1023/A:1003202413045
14. C. W. Hamd and H. L. Blewitt, Acid-Base Chemistry, p. 104, Macmillan, New York (1986).
15. W. F. Linke and A. Seidel, Solubilities, Inorganic and Metal Organic Compounds; a Compilation of Solubility Data From the Periodical Literature, 8th ed., p. 995, Van Nostrand, Princeton, New Jersey, (1958).
16. J. J. Kim, S.-K. Kim, C. H. Lee, and Y. S. Kim, J. Vac. Sci. Technol., B, 21, 33 (2003). 10.1116/1.1529654
17. T. Hara, K. Sakata, and Y. Yoshida, Electrochem. Solid-State Lett., 5, C41 (2002). 10.1149/1.1448186 (Pubitemid 34300674)
18. J. O. Dukovic, IBM J. Res. Dev., 37, 125 (1993). 10.1147/rd.372.0125
19. T. P. Moffat, J. E. Bonevich, W. H. Huber, A. Stanishevsky, D. R. Kelly, G. R. Stafford, and D. Josell, J. Electrochem. Soc., 147, 4524 (2000). 10.1149/1.1394096 (Pubitemid 32087650)
20. T. P. Moffat, D. Wheeler, M. D. Edelstein, and D. Josell, IBM J. Res. Dev., 49, 19 (2005). 10.1147/rd.491.0019
21. S. K. Cho, S.-K. Kim, and J. J. Kim, J. Electrochem. Soc., 152, C330 (2005). 10.1149/1.1891645 (Pubitemid 40785604)
22. W.-P. Dow, C.-C. Li, M.-W. Lin, G.-W. Su, and C.-C. Huang, J. Electrochem. Soc., 156, D314 (2009). 10.1149/1.3147273
23. Z. V. Feng, X. Li, and A. A. Gewirth, J. Phys. Chem. B, 107, 9415 (2003). 10.1021/jp034875m
24. M. L. Walker, L. J. Richter, and T. P. Moffat, J. Electrochem. Soc., 152, C403 (2005). 10.1149/1.1915271 (Pubitemid 41013485)
25. D. W. Hardesty, J. Electrochem. Soc., 117, 168 (1970). 10.1149/1.2407458
26. O. Lhn, A. Radisic, P. M. Vereecken, C. V. Hoof, W. Ruythooren, and J.-P. Celis, Electrochem. Solid-State Lett., 12, D39 (2009). 10.1149/1.3087790
27. K. Kondo, Y. Suzuki, T. Saito, N. Okamoto, and M. Takauchi, Electrochem. Solid-State Lett., 13, D26 (2010). 10.1149/1.3313451
28. E. Delbos, L. Omns, and A. Etcheberry, Microelectron. Eng., 87, 514 (2010). 10.1016/j.mee.2009.06.008
29. G. Holmbom and B. E. Jacobsson, Surf. Coat. Technol., 35, 333 (1988). 10.1016/0257-8972(88)90046-1