Linear sweep voltammetry of the electrodeposition of copper from a methanesulfonic acid bath containing a perfluorinated cationic surfactant

Surface and Coatings Technology

Volumn 202, Issue 13, 2008, Pages 3050-3057

  Low, C T J ^a   Walsh, F C ^a  

^a UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

Author keywords

Diffusion coefficient; Methanesulfonic acid; Perfluorinated cationic surfactant; Rotating disc and cylinder electrodes; Surface morphology; Voltammetry

Indexed keywords

ACIDS; CATIONIC SURFACTANTS; CHARGE TRANSFER; COPPER; CURRENT DENSITY; DIFFUSION; SURFACE MORPHOLOGY;

HYDROGEN EVOLUTION; METHANESULFONIC ACID BATH; NUCLEATION POTENTIAL;

ELECTRODEPOSITION;

ACIDS; CATIONIC SURFACTANTS; CHARGE TRANSFER; COPPER; CURRENT DENSITY; DIFFUSION; ELECTRODEPOSITION; SURFACE MORPHOLOGY;

EID: 44249102127     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.11.005     Document Type: Article

References (27)

1. Lowenheim F.A. Modern Electroplating (1974), John Reily & Sons, Inc. 183
2. Martyak N.M., Gernon M.D., and Janney P. Atofina Chemical Inc., Electroplating of copper from alkanesulfonate electrolytes, United States Patent Office (August (2003)) US6605204
3. Christel V.W., Marco S., Marlies K., and Joachim H. Method for Electrolytic Deposition of Metal, Ethone, Japan Patent Office (March (2006)) JP2006063450
4. Leon R.B., et al. Electrolytic Copper Plating Method, United States Patent Office (September (2002)) US6444110
5. Bernards R.F., Fisher G., Sonnenberg W., Cerwonka E.J., and Fisher S. Additive For Acid Copper Electroplating Electrolyte to Increase Throwing Power, Shipley Company Inc., United States Patent Office (Sept. (1991)) US5051154
6. Andricacos P.C., Chang I.C., Hariklia D., and Horkans J. Acid Electrolyte Solution and Process for the Electrodeposition of Copper-Rich Alloys Exploiting The Phenomenon of Underpotential Deposition (January (1995)), International Business Machines Corporation, Armonk, NY, United States Patent Office US5385661
7. Retter U., and Tchachnikova M. J. Electroanal. Chem. 550 (2003) 201
8. Rusling J.F. Colloids Surf. 123 (1997) 81
9. TM Zonyl®-ForaFac® Fluoroadditives, E.I. du Pont de Nemours & Company, www.dupont.com.
10. R.C. Desjarlais, James River Graphics Inc., South Hadley, Mass., U.S. Patent 4781985 (1988).
11. Cachet C., Keddam M., Mariotte V., and Wiart R. Electrochim. Acta 38 15 (1993) 2203
12. Cachet C., Keddam M., Mariotte V., and Wiart R. Electrochim. Acta 39 18 (1994) 2743
13. Low C.T.J., and Walsh F.C. Surf. Coat. Technol. 202 (2008) 1339
14. Nikolić N.D., Popov K.I., Pavlović Lj.J., and Pavlović M.G. Electrochim. Acta 52 28 (2007) 8096
15. Nikolić N.D., Popov K.I., Pavlović Lj.J., and Pavlović M.G. J. Electroanal. Chem. 588 (2006) 88
16. Bozzini B., D'Urzo L., and Mele C. Electrochim. Acta 52 14 (2007) 4767
17. Kondo K., Yamakawa N., Tanaka Z., and Hayashi K. J. Electroanal. Chem. 559 15 (2003) 137
18. Helly J.P., Pletcher D., and Goodenough M. J. Electroanal. Chem. 338 (1992) 155
19. Kelly J.J., and West A.C. J. Electrochem. Soc. 145 (1998) 3472
20. Kelly J.J., and A.C. West. J. Electrochem. Soc. 145 (1998) 3477
21. Cao Y., Taephaisitphonse P., Chulpa R., and West A.C. J. Electrochem. Soc. 148 (2001) C466
22. Taephaisitphonse P., Cao Y., and West A.C. J. Electrochem. Soc. 148 (2001) C492
23. Tantavichet N., and Pritzker M.D. Electrochim. Acta 50 (2005) 1849
24. Bonou L. Electrochim. Acta 47 (2002) 4139
25. Dow W.P., Huang H.S., yen M.Y., and Huang H.C. J. Electrochem. Soc. 152 (2005) C425
26. Ishikawa M., Hagiwara H., and Kimizuka R. Via-filling Process, United States Patent Office (2003) US6518182
27. Vereeken P.M., Binstead R.A., Deligianni H., and Andricacos P.C. IBM J. Res. Develop. 49 (2005) 3