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Journal of the Electrochemical Society

Volumn 157, Issue 5, 2010, Pages

Cu electrodeposition from methanesulfonate electrolytes for ULSI and MEMS applications

(2) Hasan, Maksudul a Rohan, James F a

a UNIVERSITY COLLEGE CORK (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIZED ALUMINUM OXIDE; CU DEPOSITION; CU SPECIES; DIFFUSION COEFFICIENTS; ELECTRICAL INTERCONNECTS; ELECTROCHEMICAL NUCLEATION; GLASSY CARBON ELECTRODES; HIGH EFFICIENCY; MEMS APPLICATIONS; METAL DEPOSITION; METHANE SULFONIC ACID; METHANESULFONATES; MICROELECTROMECHANICAL SYSTEMS; OVERPOTENTIAL; POTENTIAL APPLICATIONS; SEED LAYER; SI SUBSTRATES; SULFATE BATH; ULTRALARGE SCALE INTEGRATION; UV-VISIBLE; VOID FORMATION;

ACIDS; ALUMINA; COMPOSITE MICROMECHANICS; COPPER PLATING; ELECTRODEPOSITION; ELECTROLYTES; GLASS MEMBRANE ELECTRODES; GLASSY CARBON; MEMS; MICROELECTROMECHANICAL DEVICES; NANORODS; NUCLEATION; SULFURIC ACID; ULSI CIRCUITS;

ALUMINUM COATINGS;

EID: 77951195416 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.3332729 Document Type: Article

Times cited : (42)

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