SCOPUS 정보 검색 플랫폼

Volumn 28, Issue 7, 1998, Pages 737-743

Solution equilibrium characteristics of electroless copper deposition on thermally-activated palladium-catalysed polyimide substrates

Author keywords

Deposition rate; Electroless copper; Solution equilibrium model

Indexed keywords

CALCULATIONS; CATALYSIS; COMPLEXATION; COPPER PLATING; ORGANIC ACIDS; PALLADIUM; POLYIMIDES; REACTION KINETICS; SOLUTIONS;

DEPOSITION RATE; EQUILIBRIUM CONSTANTS;

ELECTROLESS PLATING;

EID: 0032120468 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1023/A:1003202413045 Document Type: Article

Times cited : (13)

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