Studies on low-temperature direct bonding of VUV, VUV/O3 and O2 plasma pretreated cyclo-olefin polymer

Sensors and Actuators, A: Physical

Volumn 165, Issue 1, 2011, Pages 124-131

  Shinohara, Hidetoshi ^a   Mizuno, Jun ^a   Shoji, Shuichi ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

Cyclo olefin polymer; Direct bonding; Oxygen plasma; Vacuum ultraviolet light

Indexed keywords

ATTENUATED TOTAL REFLECTIONS; BOND STRENGTH; CYCLO-OLEFIN POLYMERS; DIPOLAR INTERACTION; DIRECT BONDING; FOURIER; FRACTURED SURFACES; LOW TEMPERATURES; OXYGEN GAS; OXYGEN PLASMA; OXYGEN PLASMA TREATMENTS; POLAR FUNCTIONAL GROUPS; PRE-TREATMENTS; ROOM TEMPERATURE; SURFACE ANALYSIS METHODS; TENSILE TESTS; THERMAL-ANNEALING; VACUUM ULTRAVIOLET LIGHT; VUV IRRADIATION;

ANGLE MEASUREMENT; ATOMIC FORCE MICROSCOPY; ATOMIC SPECTROSCOPY; BOND STRENGTH (CHEMICAL); CONTACT ANGLE; DEGRADATION; FUNCTIONAL GROUPS; HYDROGEN; IRRADIATION; OLEFINS; OXYGEN; PLASMA APPLICATIONS; PLASMAS; POLYMERS; SPECTROMETERS; SURFACE ANALYSIS; TENSILE STRENGTH; TENSILE TESTING; ULTRAVIOLET RADIATION; VACUUM; X RAY PHOTOELECTRON SPECTROSCOPY;

HYDROGEN BONDS;

EID: 79951769670     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2010.04.006     Document Type: Conference Paper

References (47)

1. H. Becker, and U. Heim Hot embossing as a method for the fabrication of polymer high aspect ratio structures Sens. Actuators A 83 2000 130 135
2. S.J. Park, K.S. Cho, and C.G. Choi Effect of fluorine plasma treatment on PMMA and their application to passive optical waveguides J. Colloid Interface Sci. 258 2003 424 426
3. E.W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, and D. Münchmeyer Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA Process) Microelectron. Eng. 4 1986 35 56 (Pubitemid 16587242)
4. M. Svedberg, A. Pettersson, S. Nilsson, J. Bergquist, L. Nyholm, F. Nikolajeff, and K. Markides Sheathless electrospray from polymer microchips Anal. Chem. 75 2003 3934 3940 (Pubitemid 36962134)
5. J. Haisma, M. Verheijen, K.V.D. Heuvel, and J.V.D. Berg Mold-assisted nanolithography: a process for reliable pattern replication J. Vac. Sci. Technol. B 14 1996 4124 4128 (Pubitemid 126582845)
6. Y. Kawaguchi, F. Nonaka, and Y. Sanada Fluorinated materials for UV nanoimprint lithography Microelectron. Eng. 84 2007 973 976 (Pubitemid 46680541)
7. D.C. Duffy, J.C. McDonald, O.J.A. Schueller, and G.M. Whitesides Rapid prototyping of microfluidic systems in poly(dimethylsiloxane) Anal. Chem. 70 1998 4974 4984
8. B.E. Slentz, N.A. Penner, E. Lugowska, and F. Regnier Nanoliter capillary electrochromatography columns based on collocated monolithic support structures molded in poly(dimethylsiloxane) Electrophoresis 22 2001 3736 3743
9. G.A.C.M. Spierings, and J. Haisma Direct bonding of organic materials Appl. Phys. Lett. 64 1994 3246 3248
10. Z. Chen, Y. Gao, J. Lin, R. Su, and Y. Xie Vacuum-assisted thermal bonding of plastic capillary electrophoresis microchip imprinted with stainless steel template J. Chromatogr. A 1038 2004 239 245 (Pubitemid 38624371)
11. J. Wang, M. Pumera, M.P. Chatrathi, A. Escarpa, R. Konrad, A. Griebel, W. Dörnger, and H. Löwe Towards disposable lab-on-a-chip: poly(methylmethacrylate) microchip electrophoresis device with electrochemical detection Electrophoresis 23 2002 596 601 (Pubitemid 34232962)
12. C.H. Lin, C.H. Chao, and C.W. Lan Low azeotropic solvent for bonding of PMMA microfluidic devices Sens. Actuators B 121 2007 698 705
13. B. Graß, A. Neyer, M. Jöhnck, D. Siepe, F. Eisenbeiß, G. Weber, and R. Hergenröder A new PMMA-microchip device for isotachophoresis with integrated conductivity detector Sens. Actuators B 72 2001 249 258 (Pubitemid 32160790)
14. K.F. Lei, S. Ahsan, N. Budraa, W.J. Li, and J.D. Mai Microwave bonding of polymer-based substrates for potential encapsulated micro/nanofluidic device fabrication Sens. Actuators A 114 2004 340 346
15. M. Yamazaki Industrialization and application development of cyclo-olefin polymer J. Mol. Catal. A 213 2004 81 87
16. J. Mizuno, H. Ishida, S. Farrens, V. Dragoi, H. Shinohara, T. Suzuki, M. Ishizuka, T. Glinsner, F.P. Lindner, and S. Shoji Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding Tech. Digest, IEEE Int. Conf. Solid-state Sens. Actuators and Microsystems Seoul Korea, June 5-9 2005
17. F. Kitagawa, T. Suzuki, J. Mizuno, S. Shoji, and K. Otsuka High performance electrophoretic analysis on cycloolefin polymer microchips Tech. Digest, Int. Conf. Miniaturized Systems for Chemistry and Life Sciences Tokyo, Japan, November 5-9 2006
18. H. Shinohara, T. Suzuki, F. Kitagawa, J. Mizuno, K. Otsuka, and S. Shoji Polymer microchip integrated with nano-electrospray tip for electrophoresis-mass spectrometry Sens. Actuators B 132 2008 368 373
19. Homepage of Zeon Corp., accessed August 5, 2009, http://www.zeon.co.jp/ business-e/enterprise/speplast/speplast1.html.
20. M. Ishizuka, T. Suzuki, H. Shinohara, H. Houjou, S. Motokawa, J. Mizuno, T. Momma, T. Osaka, and S. Shoji Cost effective plastic micro direct methanol fuel cell (μDMFC) Tech. Digest, Int. Conf. Miniaturized Systems for Chemistry and Life Sciences Boston, USA, October 9-13 2005
21. H. Shinohara, J. Mizuno, and S. Shoji Low temperature direct bonding of poly(methyl methacrylate) for polymer microchips IEEJ Trans. Electr. Electron. Eng. 2 2007 301 306 (Pubitemid 46715016)
22. H. Shinohara, J. Mizuno, and S. Shoji Studies on low-temperature direct bonding methods of PMMA and COP using surface pretreatment Tech. Digest, Int. Conf. Electron. Packaging Kyoto, Japan, April 14-16 2009
23. R. Truckenmüller, P. Henzi, D. Herrmann, V. Saile, and W.K. Schomburg Bonding of polymer microstructures by UV irradiation and subsequent welding at low temperatures Microsyst. Technol. 10 2004 372 374
24. A. Bhattacharyya, and C.M. Klapperich Mechanical and chemical analysis of plasma and ultraviolet-ozone surface treatments for thermal bonding of polymeric microfluidic devices Lab Chip 7 2007 876 882 (Pubitemid 47000810)
25. J. Liu, H. Qiao, C. Liu, Z. Xu, Y. Li, and L. Wang Plasma assisted thermal bonding for PMMA microfluidic chips with integrated metal microelectrodes Sens. Actuators B 141 2009 646 651
26. C.W. Tsao, L. Hromada, J. Liu, P. Kumar, and D.L. DeVoe Low temperature bonding of PMMA and COC microfluidic substrates using UV/ozone surface treatment Lab Chip 7 2007 499 505 (Pubitemid 46496556)
27. T. Koerner, L. Brown, R. Xie, and R.D. Oleschuk Epoxy resins as stamps for hot embossing of microstructures and microfluidic channels Sens. Actuators B 107 2005 632 639 (Pubitemid 40655003)
28. A. Hozumi, H. Inagaki, and T. Kameyama The hydrophilization of polystylene substrates by 172-nm vacuum ultraviolet light J. Colloid Interface Sci. 278 2004 383 392 (Pubitemid 39144385)
29. H. Shinohara, Y. Takahashi, J. Mizuno, and S. Shoji Surface hydrophilic treatment of polyurea film realized by vacuum ultraviolet light irradiation and its application for poly(methylmethacrylate) blood analysis chip Sens. Actuators B 132 2008 374 379
30. V. Dragoi, S. Farrens, P. Lidner, and J. Weixlberger Low-temperature wafer bonding for microsystems applications Tech. Digest, IEEE Int. Semicond. Conf. Sinaia, Romania 2004 4 6
31. U. Schulz, P. Munzert, and N. Kaiser Surface modification of PMMA by DC glow discharge and microwave plasma treatment for the improvement of coating adhesion Surf. Coat. Technol. 142-144 2001 507 511 (Pubitemid 32931754)
32. G.P. López, D.G. Castner, and B.D. Ratner XPS O1s binding energies for polymers containing hydroxyl, ether, ketone and ester groups Surf. Interface Anal. 17 1991 267 272
33. A. Chilkoti, and B.D. Ratner An X-ray photoelectron spectroscopic investigation of the selectivity of hydroxyl derivatization reactions Surf. Interface Anal. 17 1991 567 574 (Pubitemid 21727445)
34. J. Chai, F. Lu, B. Li, and D.Y. Kwok Wettability interpretation of oxygen plasma modified poly(methyl methacrylate) Langmuir 20 2004 10919 10927
35. G.A. Diaz-Quijada, R. Peytavi, A. Nantel, E. Roy, M.G. Bergeron, M.M. Dumoulin, and T. Veres Surface modification of thermoplastics-towards the plastic biochip for high throughput screening devices Lab Chip 7 2007 856 862 (Pubitemid 47000809)
36. Y.-J. Kim, Y. Taniguchi, K. Murase, Y. Taguchi, and H. Sugimura Vacuum ultraviolet-induced surface modification of cyclo-olefin polymer substrates for photochemical activation bonding Appl. Surf. Sci. 255 2009 3648 3654
37. D.K. Owens, and R.C. Wendt Estimation of the surface free energy of polymers J. Appl. Polym. Sci. 13 1969 1741 1747
38. http://www007.upp.so-net.ne.jp/y-kondo/surface.htm.
39. Spectral Database for Organic Compounds (SDBS), http://riodb01.ibase. aist.go.jp/sdbs/cgi-bin/direct-frame-top.cgi.
40. C. Gui, H. Albers, J.G.E. Gardeniers, M. Elwenspoek, and P.V. Lambeck Fusion bonding of rough surfaces with polishing technique for silicon micromachining Microsyst. Technol. 3 1997 122 128 (Pubitemid 127523848)
41. H.H. Yu, and Z. Suo A model of wafer bonding by elastic accommodation J. Mech. Phys. Solids 46 1998 829 844 (Pubitemid 128378391)
42. K.T. Turner, S.M. Spearing, W.A. Baylies, M. Robinson, and R. Smythe Effect of nanotopography in direct wafer bonding: modeling and measurements IEEE Trans. Semicond. Manuf. 18 2005 289 296 (Pubitemid 40730009)
43. N. Miki, and S.M. Spearing Effect of nanoscale surface roughness on the bonding energy of direct-bonded silicon wafers J. Appl. Phys. 94 2003 6800 6806
44. Z. Tang, P. Peng, T. Shi, G. Liao, L. Nie, and S. Liu Effect of nanoscale surface topography on low temperature direct wafer bonding process with UV activation Sens. Actuators A 151 2009 81 86
45. M. Pfestorf, U. Engel, and M. Geiger Three-dimensional characterization of surfaces for sheet metal forming Wear 216 1998 244 250
46. 2 plasma treatment Eur. Polym. J. 42 2006 1558 1568 (Pubitemid 43849708)
47. C. Arpagaus, A. Rossi, and P.R.V. Rohr Short-time plasma surface modification of HDPE powder in a plasma downer reactor - process, wettability improvement and ageing effects Appl. Surf. Sci. 252 2005 1581 1595 (Pubitemid 41668410)