Low-temperature direct bonding of poly(methyl methacrylate) for polymer microchips

IEEJ Transactions on Electrical and Electronic Engineering

Volumn 2, Issue 3, 2007, Pages 301-306

  Shinohara, Hidetoshi ^a   Mizuno, Jun ^a   Shoji, Shuichi ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

Direct bonding; Hot embossing; Oxygen plasma; PMMA microchip; Ultraviolet light; Vacuum ultraviolet light

Indexed keywords

ANNEALING; ATMOSPHERIC PRESSURE; CHEMICAL BONDS; SURFACE TREATMENT; ULTRAVIOLET RADIATION;

DIRECT BONDING; HOT-EMBOSSING; OXYGEN PLASMA; PMMA MICROCHIP; ULTRAVIOLET LIGHT; VACUUM ULTRAVIOLET LIGHT;

POLYMETHYL METHACRYLATES;

EID: 34248208173     PISSN: 19314973     EISSN: 19314981     Source Type: Journal    
DOI: 10.1002/tee.20157     Document Type: Article

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