Hot embossing as a method for the fabrication of polymer high aspect ratio structures

Sensors and Actuators, A: Physical

Volumn 83, Issue 1, 2000, Pages 130-135

  Becker, Holger ^a   Heim, Ulf ^a  

^a Jenoptik Mikrotechnik   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; FLUIDICS; MICROMACHINING; MICROSTRUCTURE; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES;

HOT EMBOSSING; MICROFLUIDICS;

SEMICONDUCTING POLYMERS;

EID: 0033732466     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00296-X     Document Type: Article

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