Plasma assisted thermal bonding for PMMA microfluidic chips with integrated metal microelectrodes

Sensors and Actuators, B: Chemical

Volumn 141, Issue 2, 2009, Pages 646-651

  Liu, Junshan ^a   Qiao, Hongchao ^a   Liu, Chong ^a   Xu, Zheng ^a   Li, Yongqian ^b   Wang, Liding ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

Microelectrode; Microfluidic; Plasma; PMMA; Thermal bonding

Indexed keywords

BONDING METHODS; BONDING STRENGTH; BONDING TEMPERATURES; COVER PLATE; ELECTRODE PLATES; ELECTROOSMOTIC PUMPS; FAILURE PRESSURE; FRACTURE BEHAVIOR; INTERDIGITATED MICROELECTRODE ARRAY; MICROFLUIDIC CHIP; OXYGEN PLASMA TREATMENTS; OXYGEN PLASMAS; PLASMA MODIFICATIONS; PMMA; POLY(METHYL METHACRYLATE); THERMAL BONDING;

BIOCHIPS; CONTACT ANGLE; DIFFUSION BONDING; FLUIDIC DEVICES; FRACTURE; MICROFLUIDICS; OXYGEN; PHOTORESISTS; PLASMA APPLICATIONS; PLASMAS; SURFACE DEFECTS;

MICROELECTRODES;

EID: 68949172251     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.snb.2009.07.032     Document Type: Article

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