Interfacial reactions of Sn/Ag/Cu tri-layer on a deformed polyimide substrate

Journal of Alloys and Compounds

Volumn 502, Issue 2, 2010, Pages

  Lin, Chi Pu ^a   Chen, Chih Ming ^a   Lin, Ching Hsuan ^a   Su, Wen Chiung ^b  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Diffusion; Intermetallics; Metals and alloys; Microstructure

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; DIFFUSION; INTERMETALLICS; METALLURGY; MICROELECTRONICS; MICROSTRUCTURE; POLYIMIDES; SILVER; SILVER ALLOYS; TIN ALLOYS;

COMPRESSIVE STRAIN; FLEXIBLE MICROELECTRONICS; INFLUENTIAL FACTORS; METALS AND ALLOYS; MULTILAYER STRUCTURES; PLASTIC SUBSTRATES; POLYIMIDE SUBSTRATE; TRILAYER STRUCTURE;

TENSILE STRAIN;

EID: 77955174991     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2010.04.197     Document Type: Letter

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