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Applied Surface Science

Volumn 257, Issue 9, 2011, Pages 4422-4427

Characterization of a controlled electroless deposition of copper thin film on germanium and silicon surfaces

(3) Scudiero, Louis a Fasasi, Ayuba b Griffiths, Peter R b

a WASHINGTON STATE UNIVERSITY (United States)

b UNIVERSITY OF IDAHO (United States)

Author keywords

Copper films; Electroless deposition; Germanium substrate; Oxidation; Silicon substrate

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER COMPOUNDS; DEPOSITION; ELECTROLESS PLATING; FILM GROWTH; GERMANIUM; HYDROFLUORIC ACID; METALLIC FILMS; OXIDATION; SILICON; SILICON OXIDES; SULFUR COMPOUNDS; THIN FILMS; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER FILMS; EXPENSIVE EQUIPMENTS; GERMANIUM SUBSTRATES; POLYCRYSTALLINE GERMANIUM SUBSTRATES; POWDER X-RAY DIFFRACTION (PXRD); PREFERENTIAL ORIENTATION; SILICON SUBSTRATES; STRESS-INDUCED VOIDING;

SUBSTRATES;

EID: 78951475666 PISSN: 01694332 EISSN: None Source Type: Journal
DOI: 10.1016/j.apsusc.2010.12.078 Document Type: Article

Times cited : (19)

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