Novel fabrication of Cu interconnection by displacing the prepatterned Ti film for ULSI

Journal of the Electrochemical Society

Volumn 152, Issue 7, 2005, Pages

  Yang, Chin Hao ^a   Yang, Wen Luh ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ADHESION; ANNEALING; ELECTRIC CONDUCTIVITY; FABRICATION; REACTION KINETICS; SPUTTERING; TITANIUM COMPOUNDS; ULSI CIRCUITS;

COPPER FILMS; DIELECTRIC LAYERS; METALLIZATION TECHNOLOGY; THERMAL ANNEALING;

THIN FILMS;

EID: 23744434294     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1928170     Document Type: Article

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